Advantages and Disadvantages of Ceramic Packages

Release time：2024-09-11click：4

Ceramic packaging is the main packaging technology for high reliability requirements. The current ceramic technology can control the dimensional change of sintering within the range of 0.1%, and can be combined with thick film technology to create a multi-layer wiring conductive structure of 30-60 layers. Therefore, ceramics are also mainly used as a substrate for making chip components (MCM) packaging. one of the materials.

Advantages:
(1) In the packaging of various IC components, ceramic packaging can provide airtight packaging protection for the IC chip, making it have excellent reliability;
(2) Ceramics are used as materials for IC chip packaging because they are extremely stable in terms of electrical, thermal, and mechanical properties, and their properties can be achieved by changing their chemical composition and process control and adjustment. Not only can they be used as packaging The capping material is also an important carrier substrate for various microelectronic products.

Disadvantages:
(1) Compared with plastic packaging, its process temperature is higher and the cost is higher;
(2) Process automation and thin packaging capabilities are inferior to plastic packaging;
(3) It has high brittleness and can easily cause stress damage;
(4) In packaging that requires low dielectric constant and high wiring density, it must compete with thin film packaging technology.

In recent years, although ceramic packaging has been the most practical packaging method, ceramic packaging is still the most important packaging method that requires high reliability. Whether it is ceramic packaging or plastic packaging, they have their own areas of expertise. Under different packaging processes, their value expressions are different. There is no such thing as a good one or a bad one. The important thing is to know how to choose the most appropriate packaging material.

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